Thursday, October 23, 2003
October 2003 Meeting--Suspended Substrates and Their Applications in High Speed Communications.
VENUE:
Agilent Technologies, 5301 Stevens Creek Blvd., Bldg.50, Santa Clara, CA.
Date and Time:
Thursday October 30, 2003 at 6:00 PM.
ABSTRACT:
Signal integrity, at the new Gigahertz data rates, suffers from negative effects of the dielectric material of the PCB? that the signals go through. Three-inch traces at 10 GHz are long enough to attenuate the signal significantly. The propagation speed is only half that of air and the signal transitions are widened by variations in propagation speed with frequency. Air dielectric eliminates these PCB related negative effects including over half of the attenuation at 1 GHz and over 75 percent of the attenuation at 10 GHz. It also eliminates most signal transition dispersion and allows speed of light propagation. This presentation will discuss a technique for fabricating PCB? using an air dielectric, incorporating the principle of suspended substrate structure. Metal shielding in the suspended substrate effectively eliminates EMI, EMC and cross talk. The costs for these new PCB? will carry an approximate 20% production premium when compared to a similar standard FR4, PCB. This presentation will show that the many performance improvements of suspended substrate PCB?, when compared to standard FR4, more than compensate for the increase in cost.
VENUE:
Agilent Technologies, 5301 Stevens Creek Blvd., Bldg.50, Santa Clara, CA.
Date and Time:
Thursday October 30, 2003 at 6:00 PM.
ABSTRACT:
Signal integrity, at the new Gigahertz data rates, suffers from negative effects of the dielectric material of the PCB? that the signals go through. Three-inch traces at 10 GHz are long enough to attenuate the signal significantly. The propagation speed is only half that of air and the signal transitions are widened by variations in propagation speed with frequency. Air dielectric eliminates these PCB related negative effects including over half of the attenuation at 1 GHz and over 75 percent of the attenuation at 10 GHz. It also eliminates most signal transition dispersion and allows speed of light propagation. This presentation will discuss a technique for fabricating PCB? using an air dielectric, incorporating the principle of suspended substrate structure. Metal shielding in the suspended substrate effectively eliminates EMI, EMC and cross talk. The costs for these new PCB? will carry an approximate 20% production premium when compared to a similar standard FR4, PCB. This presentation will show that the many performance improvements of suspended substrate PCB?, when compared to standard FR4, more than compensate for the increase in cost.
